PCB Fabrication Technology
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| Minimum Line Spacing (Internal) |
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.001" |
| Minimum Line Width (External) |
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.001" |
| Minimum Line Spacing (External) |
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.001" |
| Minimum Via Size |
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.004" drilled |
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| Microvias |
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Yes |
| Copper Filled Microvia |
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Yes |
| Buried Vias |
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Yes |
| Blind Vias |
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Yes |
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| Maximum Aspect Ratio |
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28 to 1 |
| Controlled Impedance tolerance |
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+/-5% |
| Buried Capacitance |
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Yes |
| Buried Resistance |
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Yes |
| Maximum Layer Count |
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Design Dependent |
| Minimum Thickness |
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.001" |
| Maximum Thickness |
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.320" |
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| Selective Soft Gold |
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Yes |
| Selective Hard Gold |
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Yes |
| Electroless Nickel Immersion Gold (ENIG) |
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Yes |
| HASL |
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Yes |
| Fused Sn/Pb |
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Yes |
| OSP |
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Yes |
| Palladium-Nickel |
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Yes |
| Immersion Tin |
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Yes |
| Immersion Silver |
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Yes |
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| FR-4 |
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Yes |
| High Tg 170 FR-4 |
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Yes |
| Polyimide |
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Yes |
| BT Resin |
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Yes |
| Rogers |
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Yes |
| Taconic |
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Yes |
| Nelco |
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Yes |
| Stablcor |
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Yes |
| Ohmega Ply Resistive Foils |
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Yes |
| Copper - Invar - Copper |
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Yes |
| Aluminum/ Copper Heat Sinks |
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Yes |
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| Flexible Circuits |
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Yes
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Rigid-flex Circuits
** Ask for a copy of our design guidelines*** |
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Yes |
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| Quick Turn Capability |
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Yes |
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| ISO 9000 |
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Yes |
| ISO 14000 |
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Yes |
| Mil-PRF 31032 |
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Yes |
| AS9100 |
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Yes |
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| Off shore facilities |
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Yes |