Zeta Cap is low profile foil coated with polyimide film

The future of Thin

Zeta Lam

A HDI build up material

Zeta Lam = Copper foil + C Stage Film + B Stage Layer

Primary applications for Zeta Lam are density and fine pitch

     *  No glass weave = no wicking, via to via and via to trace spacing can be smaller than before.

     *  Thin = via diameters down to 2 mils ( 50 microns) and still platable by the PCB shop.

     *  Low profile copper (<2.5 microns) = easier to etch fine lines.

     *  More layers in a given thickness; each dielectric layer adds only 14, 27 or 40 microns in thickness depending on C-stage choice.

     *  Thinner layers with the same impedance due to lower Dk without glass fabric, no signal skew.


Zeta Cap

Zeta Cap is used as an outerlayer foil substitute to prevent pad cratering in PCBs which occurs primarily under the solder balls in BGAs.

How does Zeta Cap work serving as a barrier to block Pad Cratering?

  • High strength without being brittle
  • Unique modulus allows for some flexibility
  • Very high Tg and Td
  • Very low CTE of 19 ppm/deg C (close to copper and solder)
  • Halogen free
  • Lead free compatible

Board designs subject to Pad Cratering:

  • Finer pitch components; generally < 0.5 mm
  • Use of more brittle lead free laminates
  • Stiffer solders ( SAC vs. Sn Pb)
  • Presence of large heat sinks
  • PCB thickness; the thinner the board, the more likely pad cratering will occur
  • Temperatures and cooling rates

Zeta  Materials

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Zeta Cap

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